1.Micro LED thev naus laus zis, raws li thaj tsam pem hauv ntej hauv - tiam tshiab cov cuab yeej technology, tau txais kev saib xyuas thiab kev tshawb fawb. Piv nrog rau cov khoom siv ua kua siv lead ua kua thiab cov teeb pom kev hauv cov organic-emitting diodes (OLED), Micro LED muaj qhov ci ntsa iab dua, qhov sib txawv dua, thiab cov xim dav dua, thaum tseem muaj kev siv hluav taws xob qis dua thiab lub neej ntev dua. Qhov no ua rau Micro LED muaj peev xwm loj heev hauv thaj chaw xws li TVs, smartphones, me me -size smart wearables, hauv -cov ntxaij vab tshaus tsheb, thiab AR/VR. Qhov parameter sib piv ntawm Micro LED, LCD, thiab OLED yog qhia hauv daim duab 1.
Kev hloov pauv loj yog ib kauj ruam tseem ceeb hauv kev hloov Micro LED chips los ntawm kev loj hlob substrate mus rau lub hom phiaj substrate. Vim lub siab ceev thiab me me ntawm Micro LED chips, ib txwm hloov txoj kev tawm tsam kom ua tau raws li qhov yuav tsum tau muaj siab. Kev ua tiav cov khoom lag luam uas sib txuas nrog Micro LEDs nrog cov tsav tsheb hauv Circuit Court yuav tsum muaj ntau qhov kev hloov pauv ntawm Micro LED chips (tsawg kawg los ntawm sapphire substrate mus rau ib ntus substrate rau cov substrate tshiab), nrog ntau cov chips pauv txhua zaus, muab siab xav tau ntawm kev ruaj ntseg thiab precision ntawm cov txheej txheem hloov mus. Laser huab hwm coj hloov pauv yog lub thev naus laus zis rau kev hloov Micro LED chips los ntawm haiv neeg sapphire substrate mus rau lub hom phiaj substrate. Ua ntej, cov chips raug cais los ntawm haiv neeg sapphire substrate ntawm laser tev; Tom qab ntawd, kev kho mob ablation yog nqa tawm ntawm lub hom phiaj substrate kom hloov cov chips mus rau lub substrate nrog cov khoom nplaum (xws li polydimethylsiloxane). Thaum kawg, cov chips raug xa mus los ntawm PDM substrate mus rau TFT backplane siv cov hlau sib txuas quab yuam ntawm TFT backplane.
02 Laser Peeling Technology
Thawj kauj ruam ntawm laser bulk hloov yog laser tev (LLO). Cov txiaj ntsig ntawm laser tev tawm ncaj qha txiav txim siab qhov txiaj ntsig kawg ntawm tag nrho cov txheej txheem hloov pauv laser. Micro LEDs feem ntau siv cov substrates zoo li Si thiab sapphire kom loj hlob GaN epitaxial txheej rau kev npaj. Muaj cov teeb meem tseem ceeb xws li cov lattice loj mismatch thiab qhov sib txawv ntawm thermal expansion coefficients ntawm Si cov ntaub ntawv thiab GaN; Yog li ntawd, sapphire substrates feem ntau siv thaum npaj Micro LED chips.Cov bandgap ntawm sapphire yog 9.9 eV, GaN yog 3.39 eV, thiab AlN yog 6.2 eV. Lub hauv paus ntsiab lus ntawm laser tev yog siv luv luv - wavelength lasers nrog photon zog ntau dua GaN zog bandgap tab sis tsawg dua bandgaps ntawm sapphire thiab AlN, irradiating los ntawm sab sapphire. Lub laser hla dhau sapphire thiab AlN, ces yog absorbed los ntawm nto GaN. Thaum lub sij hawm tus txheej txheem no, lub nto GaN undergoes thermal decomposition, thiab txij li thaum lub melting point ntawm Ga yog hais txog 30 degree, N2 thiab kua Ga yog generated, nrog N2 tom qab escaping, yog li ua tiav qhov kev sib cais ntawm GaN epitaxial txheej los ntawm sapphire substrate los ntawm mechanical quab yuam. Cov tshuaj tiv thaiv decomposition tshwm sim ntawm qhov interface tuaj yeem sawv cev raws li:
Raws li cov qauv rau photon zog, qhov zoo tshaj plaws laser wavelength uas ua tau raws li cov kev mob saum toj no yuav tsum poob nyob rau hauv cov nram qab no ntau yam: 125 nm < 209 nm Tsawg dua los yog sib npaug rau λ Tsawg dua los yog sib npaug rau 365 nm. Kev tshawb fawb qhia tau hais tias laser pulse dav, laser wavelength, thiab laser zog ceev yog qhov tseem ceeb hauv kev ua tiav cov txheej txheem laser ablation.
Txhawm rau kom paub txog tag nrho -xim Micro LED teeb pom kev zoo, nws yog ib qho tsim nyog los npaj thiab sib xyaw Micro LED chips liab, ntsuab, thiab xiav ntawm tib lub substrate los tsim ib qho me me, siab - daws teeb meem xim zaub pixel. Lub Laser Lift-Off (LLO) txoj kev tsis haum rau kev xaiv kev koom ua ke ntawm cov khoom siv tsis yog-liab liab, ntsuab, thiab xiav Micro LED li. Ntxiv mus, kev xaiv kho me me ntawm Micro LED chips puas yog qhov tseem ceeb rau kev txhim kho cov txiaj ntsig ntawm cov khoom lag luam. Yog li ntawd, thev naus laus zis ntawm Selective Laser Lift-Off (SLLO) tau tshwm sim. Cov thev naus laus zis no muaj feem xyuam rau kev sib koom ua ke thiab kev xaiv kho, tsis tas yuav tsum tau ua cov txheej txheem ua haujlwm nyuaj. Nws kuj tseem tuaj yeem xaiv cov kev hloov pauv tshwj xeeb ua ntej- teeb tsa LEDs thiab kho LEDs puas.SLLO ua haujlwm los ntawm kev siv laser irradiation los xaiv tev Micro LED chips los ntawm kev sib txuas nrog cov substrate. Lub teeb ultraviolet feem ntau yog siv los ua lub teeb ci. Lub teeb luv luv wavelength sib cuam tshuam nrog cov ntaub ntawv, ua kom muaj txheej txheem tev tawm ntau dua. Tsis tas li ntawd, lub tshav kub tsim thaum lub sij hawm tev txheej txheem nrog ultraviolet lub teeb yog qhov tsawg, txo qhov kev pheej hmoo ntawm thermal puas.
Uniqarta tau npaj ib qho loj -scale parallel laser peeling txoj kev, raws li qhia nyob rau hauv daim duab 4. Los ntawm kev ntxiv ib X-Y laser scanner rau ib tug mem tes laser, ib tug laser beam yog diffraced mus rau hauv ntau lub laser beams, enabling loj -scale peeling ntawm chips. Cov tswv yim no ua rau muaj ntau cov chips tev hauv ib qho kev ua haujlwm, ua tiav qhov kev tshem tawm ntawm 100 M / h, nrog kev hloov pauv raug ntawm ± 34 μm, thiab muaj peev xwm kuaj pom qhov tsis zoo, ua rau nws tsim nyog rau kev hloov pauv ntawm ntau qhov ntau thiab tsawg thiab cov ntaub ntawv tam sim no.
3 Laser Hloov Technology
Cov kauj ruam thib ob ntawm kev hloov pauv loj heev yog laser hloov pauv, uas cuam tshuam nrog kev hloov cov chips stripped los ntawm ib ntus substrate mus rau lub nraub qaum. Lub laser-induced forward transfer (LIFT) thev naus laus zis tau thov los ntawm Coherent yog ib txoj hauv kev uas tuaj yeem tso ntau yam khoom siv thiab cov qauv hauv cov neeg siv- cov qauv uas tau hais tseg, tso cai rau qhov loj - teev qhov loj ntawm cov qauv me me lossis cov khoom siv. Tam sim no, LIFT thev naus laus zis tau ua tiav kev hloov pauv ntawm ntau yam khoom siv hluav taws xob, nrog qhov ntau thiab tsawg ntawm 0.1 txog 6 mm². Daim duab 5 qhia txog cov txheej txheem LIFT ib txwm. Nyob rau hauv cov txheej txheem LIFT, lub laser hla dhau lub pob tshab substrate thiab yog absorbed los ntawm dynamic tso txheej. Vim lub ablative los yog vaporization nyhuv ntawm lub laser, lub siab siab generated los ntawm lub dynamic tso tawm txheej sai sai, yog li hloov lub nti los ntawm lub stamp mus rau lub substrate tau txais.
Tom qab kev txhim kho, Uniqarta tau tsim lub laser- ntxias cov tshuab xa mus rau pem hauv ntej raws li cov hlwv (BB-LIFT). Raws li pom hauv daim duab 6, qhov sib txawv yog tias thaum lub sij hawm laser irradiation, tsuas yog ib feem me me ntawm DRL yog ablated thiab tsim roj los muab kev cuam tshuam lub zog. Lub DRL tuaj yeem ntim cov shockwave nyob rau hauv ib lub hlwv nthuav dav, maj mam thawb lub nti mus rau qhov tau txais substrate, uas tuaj yeem txhim kho kev hloov pauv thiab txo kev puas tsuaj.
Qhov tsis yog -reusability ntawm lub stamp yog ib qho tseem ceeb txwv tsis pub siv BB-LIFT. Txhawm rau txhim kho tus nqi-kev ua tau zoo, cov kws tshawb fawb tau tsim ib lub tshuab siv rov siv tau BB-LIFT thev naus laus zis raws li kev tsim cov nyiaj siv rov qab siv tau, raws li pom hauv daim duab 7. Lub stamp muaj cov microcavities nrog txheej hlau, nrog cov kab noj hniav thiab cov pwm elastic nplaum nrog cov txheej txheem siv rau kev ntim cov microcavities. Thaum irradiated los ntawm 808 nm laser, cov hlau txheej absorbs lub laser thiab generates tshav kub, ua rau cov huab cua nyob rau hauv lub kab noj hniav kom nthuav dav, ua rau deformation ntawm lub stamp thiab txo nws cov adhesion. Nyob rau lub sijhawm no, qhov kev poob siab tsim los ntawm bubbling ua rau lub nti kom tshem tawm ntawm lub thwj.
Nyob rau hauv loj - nplai hloov, yuav tsum muaj adhesion muaj zog thaum xaiv kom ntseeg tau tias kev ntes; Thaum muab tso rau, qhov adhesion yuav tsum muaj tsawg kawg nkaus kom ua tiav kev hloov pauv, yog li cov tub ntxhais ntawm cov thev naus laus zis nyob rau hauv kev txhim kho cov adhesion quab yuam switching piv. Cov kws tshawb fawb tau kos cov microspheres nthuav dav hauv cov nplaum nplaum thiab siv lub tshuab cua sov laser los tsim cov thermal stimuli sab nraud. Thaum lub sij hawm xaiv cov txheej txheem, qhov me me - qhov loj me embedded expandable microspheres xyuas kom meej qhov flatness ntawm cov nplaum txheej ntawm qhov chaw, thaum cov nyhuv ntawm lub zog adhesion ntawm cov nplaum txheej tuaj yeem tsis quav ntsej. Txawm li cas los xij, thaum lub sijhawm hloov pauv, cov thermal stimulus sab nraud ntawm 90℃tsim los ntawm lub tshuab cua sov laser hloov mus rau txheej nplaum, ua rau cov microspheres sab hauv nthuav dav sai, raws li pom hauv daim duab 8. Qhov no ua rau cov txheej txheem micro-roughed nyob rau saum npoo, txo qhov adhesion ntawm qhov chaw thiab ua tiav kev tso tawm.
Txhawm rau ua tiav qhov loj - hloov pauv, cov kws tshawb fawb pom tias qhov hloov pauv nyob ntawm qhov kev hloov pauv ntawm qhov sib txuas ntawm TRT thiab cov khoom siv ua haujlwm, thiab yog tswj los ntawm qhov ntsuas kub, raws li pom hauv daim duab 9. Thaum qhov kub thiab txias qis dua qhov ntsuas kub tseem ceeb Tr, lub zog tso tawm tus nqi ntawm TRT / cov khoom siv ua haujlwm yog ntau dua li qhov tseem ceeb ntawm lub zog tso tawm tus nqi ntawm cov khoom siv hluav taws xob ua rau cov khoom tawg yooj yim, ua rau cov khoom tawg yooj yim. TRT/functional device interface, yog li tso cai rau cov cuab yeej siv tau tuaj tos. Thaum lub sijhawm hloov cov txheej txheem, qhov kub thiab txias tau nce siab tshaj qhov ntsuas kub tseem ceeb Tr los ntawm laser cua sov, thiab lub zog tso tawm tus nqi ntawm TRT / cov khoom siv ua haujlwm yog tsawg dua li qhov tseem ceeb ntawm lub zog tso tawm ntawm cov khoom siv ua haujlwm / lub hom phiaj substrate, tso cai rau cov cuab yeej ua haujlwm tau zoo xa mus rau lub hom phiaj substrate.
