Raws li kev lag luam qhov chaw, "Technical Renovation Project for Additive Manufacturing of AI Computing Heat Dissipation Components" tau ua ntaub ntawv rau lub Yim Hli 7. Qhov project tab tom ua los ntawm Wuhan HG-Laser Engineering Co., Ltd. thiab nyob hauv East Lake High-tech Development Zone of Wuhan, Hubei Province, 50 lab RUB.
Kev tsim kho tau teem sijhawm pib thaum Lub Yim Hli 2026. Txoj haujlwm no suav nrog kev nrhiav thiab kho cov chaw tsim khoom hauv chaw ua haujlwm, chav kuaj, thiab kev siv ntau lawm, txhim kho cov khoom tsim khoom ntxiv, thiab tsim kom muaj R&D thiab tsim khoom. Tom qab ua tiav, lub chaw yuav muaj peev xwm tsim tau txhua xyoo ntawm 2,400 laser additive manufacturing units thiab txhua xyoo tso zis muaj peev xwm ntawm 20 lab 3D- luam tawm AI xam cov khoom siv hluav taws xob.
Thermal tswj Cheebtsam rau AI xam lub hwj chim yog ib qho tseem ceeb rau kev daws cov teeb meem kub dissipation ntawm siab - zog AI chips; tshwj xeeb, hlau 3D luam ntawv thev naus laus zis-xws li Selective Laser Melting (SLM)- pab kom tsim cov kua- cov phaj txias nrog cov txheej txheem sab hauv ntws, xa cov thermal efficiency deb tshaj li cov txheej txheem tsim khoom. HGTECH tab tom nqis peev 500 lab yuan hauv ib qhov project tsim los tsim 20 lab cov khoom no ib xyoos ib zaug, siv cov xim liab thiab ntsuab laser SLM technologies los ua cov txheej txheem cov ntaub ntawv thiab cov ntaub ntawv zoo heev (xws li tooj liab ntshiab), feem. Nrog AI nti fais fab noj tam sim no ntau dua 2,300 watts thiab cov khoom siv tooj liab tsoos mus txog lawv cov thermal txwv, pob zeb diamond- uas khav thev thermal conductivity tsib npaug ntawm tooj liab- tau tshwm sim los ua qhov kev cog lus tshiab; Cov tuam txhab hauv tsev xws li Huanghe Whirlwind tau ua tiav ntau lawm ntawm 8-nti pob zeb diamond kub dab dej wafers.
