Qhov sib txawv ntawm cov tub ntxhais kawm tshuab lasers:
UV laser marking tshuab: tsim los ntawm 355nm UV laser. Cov qauv no siv tus thib peb kev yuam kom nkag mus rau qhov kev sib tw doubling technology piv nrog infrared laser. 355 UV cov ntsiab lus tseem ceeb me me, uas tuaj yeem txo cov tshuab deformation ntawm cov ntaub ntawv. Thiab cov ua cua kub muaj me ntsis nyhuv. Fiber clamping tshuab: 1064nm wavelength siv.
Hais txog qhov laser wavelength, qhov luv luv rau lub wavelength, qhov me me qhov loj qhov laser, qhov ntau dua qhov kev txiav txim siab, qhov me me cua sov-cuam tshuam cheeb tsam tsim thaum lub sij hawm ua, thiab qhov ntau zoo nkauj ua cov nyhuv.
Qhov sib txawv ntawm txoj kev ua:
Txoj kev ua cov ultraviolet laser marking tshuab txawv ntawm lwm yam khoom siv laser. Feem ntau, rau lub tshuab kos rau lub tshuab pa roj carbon fiber ntau ntawm CO2 thiab laser marking tshuab, nws yog siv rau kev kos duab ntawm lub laser, thiab ultraviolet laser marking tshuab. Nws yog kev ua los ntawm kev siv tshuaj lom neeg, feem ntau cov tshuaj lom yees duab. Qhov sib txawv ntawm qhov sib txawv ntawm ob txoj kev ua no yog qhov laser physics ua txoj kev yog qhov tseem ceeb tshaj plaws.
Yog hais tias cov nplais ntawm cov khoom thiab cov khoom tiav, lub laser tshuaj ua txoj kev yuav ua tiav rau sab hauv ntawm cov khoom siv khoom nrog ib lub laser.
Raws li txoj cai ua hauj lwm thiab kev ua haujlwm ntawm ob lub laser marking cav tov, muaj qee qhov sib txawv hauv daim teb ntawm daim ntawv thov.
Qhov txawv ntawm qhov kev siv hauv cov chaw:
Lub laser marking tshuab yog tsim rau laser npav ntawm ntau cov hniav hlau. Vim yog lub cua sov generated los ntawm nws cov nqaj, nws tsis haum rau high-precision tshwj xeeb cov khoom kos. Ultraviolet laser marking tshuab: Nws yog tshwj xeeb tshaj yog tsim rau lub high-kawg lag luam ntawm ultra-nplua processing. Cov nplaum ntim khoom rau cov tshuaj pleev ib ce, tshuaj, yees duab thiab lwm yam khoom siv polymer cim nrog cov nyhuv zoo, lub cim yog huv thiab ruaj khov, zoo tshaj tus number case coding thiab tsis muaj cov pa phem; hloov Pcb board marking, dicing; silicon wafer micro-qhov, dig muag qhov ua. Ntawm lawv, 80% ntawm cov ntaub ntawv cov kab nyob rau hauv kev ua lag luam, tus cim kos npe yog los ntawm UV laser npav.
