01 Daim Ntawv Qhia
Cov ntaub ntawv pob tshab (xws li iav thiab sapphire) yog qhov tseem ceeb hauv kev lag luam thiab kev txiav - ntug kev tshawb fawb vim lawv cov khoom zoo ntawm lub cev. Txawm li cas los xij, lawv cov hardness siab thiab siab bandgap cov yam ntxwv tau ua rau kev siv tshuab ib puas xyoo - qub kev sib tw. Lub advent ntawm femtosecond lasers tau coj ib tug kiv puag ncig rau sab hauv kev hloov kho thiab ua cov ntaub ntawv pob tshab, tab sis cov teeb meem xws li kev ua hauj lwm qeeb qeeb thiab raug cuam tshuam rau kev ntxhov siab puas tsuaj ib txwm muaj kev txwv tsis pub lawv cov ntawv thov kev lag luam (xws li qhov yuav tsum tau muaj 1000 qhov ib ob rau iav los ntawm - qhov chaw tsim khoom). Daim ntawv no qhia txog txoj hauv kev tshiab rau ultra- drilling ceev ntawm cov ntaub ntawv pob tshab ua tiav los ntawm kev siv hluav taws xob ua kom muaj zog, nrog kev ua kom nrawm dua li ib lab zaug piv rau cov txheej txheem kev cuam tshuam ib txwm muaj.
02 Txheej txheem cej luam ntawm Cov Ntawv Tag Nrho
Txoj kev tshawb no qhia txog cov txheej txheem hu ua 'Bessel transient selective laser absorption'. Ua ntej, Gaussian- faib picosecond laser yog zoo li tus beam Bessel, uas tuaj yeem ua rau lub siab ntev, zoo li electron excitation channels, lossis 'laser filaments', nrog rau ib qho xwm txheej hauv cov ntaub ntawv pob tshab. Qhov tsim ntawm cov channel no ua rau muaj kev hloov pauv sai sai ntawm cov khoom siv kho qhov muag ntawm lub picosecond mus rau nanosecond scale, hloov los ntawm ib qho insulator mus rau lub xeev zoo ib yam li cov semi-hlau, nrog rau kev nce siab ntawm kev nqus coefficient. Nyob rau tib lub sijhawm, lub laser filaments tau zoo thiab sib npaug nqus microsecond - ntev lub zog laser, tam sim ntawd cua sov cov khoom hauv cov channel mus rau qhov evaporation thiab tshem tawm. Txoj kev no cleverly zam lub plasma reflection shielding teebmeem pom nyob rau hauv ib txwm high - siv laser ua. Thaum kawg, tsuas yog kaum tawm microseconds, qhov siab - zoo los ntawm - qhov nrog txoj kab uas hla ntawm 3.1 microns thiab qhov tob - mus rau - txoj kab uas hla mus txog 322 tuaj yeem tsim hauv 1 hli tuab quartz iav, tsis muaj conicity lossis microcrack -
03 Daim duab tsom xam

Daim duab 1 (A) qhia txog kev tsim kho qhov muag pom kev, qhov chaw pulse ntawm picosecond laser thiab mem tes ntawm microsecond laser yog zoo li tus Bessel beams raws li ib tug axial prism, ces co-axially ua ke los ntawm ib tug beam splitter thiab teem rau ib tug pob tshab qauv. Daim duab 1 (B) nthuav tawm cov txheej txheem lub cev thaum lub sij hawm machining: Kauj ruam ib, lub picosecond laser induces ib tug ntev thiab uniform electron excitation channel nyob rau hauv cov khoom; Kauj ruam 2, lub zog tom ntej microsecond laser yog xaiv absorbed los ntawm cov channel no, ua tiav cov khoom tshem tawm tam sim ntawd thiab zoo ib yam, thaum kawg ua ib qho los ntawm - qhov nrog qhov sib piv siab.

Daim duab 2 intuitively qhia lub cev lub cev mechanism los ntawm lub twj tso kua mis - sojntsuam imaging technology. Bessel mem tes nrog lub mem tes dav ntawm 5 ps induces filaments nyob rau hauv lub quartz iav, tso cai rau lub ruaj khov tsim ntawm ib tug uniform excitation channel tshaj 1 hli nyob rau hauv ntev nyob rau hauv 10 ps. Qhov tseem ceeb tshaj, cov channel no, uas muaj qhov sib nqus nqus siab, tuaj yeem nyob ruaj khov rau tsawg kawg yog 1.8 ns, ntev dua li cov electron -lattice so lub sij hawm, ua kom cov ntshav nyob rau hauv siab - lub zog thiab muab cov xwm txheej txaus rau kev xaiv nqus ntawm microsecond pulses tom ntej.

Daim duab 3 qhia txog micro-theem qhov qhov morphology. Hauv 1 hli tuab quartz iav, nws tsuas yog siv sijhawm 20 microseconds los ua qhov dhau los ntawm - qhov nrog txoj kab uas hla ntawm 3.1 µm, nrog rau qhov tob - txog - txoj kab uas hla ntawm qhov siab li 322. Qhov kev pom sab pom pom tias cov channel ncaj nraim thiab tsis muaj taper, nrog cov phab ntsa du uas tsis muaj cov khib nyiab los yog cov txheej txheem microcracks. Los ntawm kev kho cov mem tes dav ntawm microsecond laser, lub qhov taub kuj tuaj yeem hloov kho rau qee yam.

Daim duab 4 qhia tau hais tias lub universality thiab industrial daim ntawv thov muaj peev xwm ntawm no technology. Ntxiv rau quartz iav, txoj kev no kuj tau ua tiav rau ntau yam khoom siv pob tshab xws li borosilicate iav thiab dej qab zib-lime iav. Los ntawm kev kho lub laser thiab siv lub siab- nrawm txav platform, nws muaj peev xwm ua tiav qhov ultra- ua haujlwm siab ntawm 1,000 qhov hauv ib ob, ntseeg tau ua ntau txhiab yam sib xws los ntawm - qhov arrays.
04 Cov ntsiab lus
Cov kev tshawb fawb nyob rau hauv tsab xov xwm no tau ua tiav ib qho kev tsim kho tshiab hauv kev ua haujlwm ntawm laser los ntawm kev siv tshuab hluav taws xob hloov hluav taws xob. Los ntawm cleverly cais ob lub cev txheej txheem ntawm 'electron excitation' thiab 'cov ntaub ntawv tshem tawm', thiab muab lawv mus rau ob lub sij hawm sib koom tes laser pulses ntawm picoseconds thiab microseconds, nws ntse kov yeej cov teeb meem tseem ceeb ntawm qeeb ceev thiab tsawg zog siv nyob rau hauv cov tsoos ultrafast laser ua, boosting lub sij hawm drilling efficiency. Cov thev naus laus zis no tsis yog tsuas yog ua kom lub ultra- nrawm, siab- zoo, thiab qhov sib piv siab los ntawm - qhov kev tsim tawm hauv millimeter- cov ntaub ntawv tuab, tab sis kuj qhia nws txoj kev thoob ntiaj teb thoob plaws ntau yam ntaub ntawv thiab muaj peev xwm loj heev rau cov khoom loj -. Qhov kev ua tiav no yuav tsum muaj kev cuam tshuam loj hauv thaj chaw xws li ntim khoom semiconductor, biomedical applications, thiab txiav- kev tshawb fawb ntug.









