Apr 16, 2026 Tso lus

Kev Tshawb Fawb Txog Kev Tshawb Fawb ntawm Laser-Assisted Compound Machining Technology rau Precision Manufacturing of Hard thiab Brittle Materials

Laser-pab tig (LAT) tam sim no yog ib qho ntawm cov ntawv tshawb fawb ntau tshaj plaws ntawm laser-pab machining (LAM). Cov txheej txheem feem ntau koom nrog kev sib koom ua ke ntawm lub taub hau laser nrog lub cuab yeej tig, xws li lub teeb laser irradiates lub rotating nto ntawm lub workpiece ua ntej ntawm cov cuab yeej txiav txoj kev (raws li qhia hauv daim duab 1). Nws cov txheej txheem tseem ceeb nyob rau hauv kev tswj lub zog laser thiab qhov chaw txoj kab uas hla kom nce qhov kub ntawm cov rhuab txheej mus rau hauv cov khoom siv hauv cov khoom siv yas. Cov kev tshawb fawb tau pom tias rau cov ntaub ntawv ceramic-xws li silicon nitride- thaum lub cua sov kub tshaj qhov muag muag ntawm lawv cov iav iav, cov khoom tshem tawm cov txheej txheem hloov ntawm cov pob txha tawg mus rau cov yas txiav, yog li tiv thaiv kev tsim ntawm microcracks nto. Tsis tas li ntawd, nyob rau hauv cov ntaub ntawv ntawm npib tsib xee-raws li alloys, laser cua sov tuaj yeem txo cov khoom ua haujlwm- cov teebmeem hardening. Raws li cov txheej txheem tsim nyog, txiav quab yuam tuaj yeem txo qis, thiab cov cuab yeej siv tau ntev. Qhov kev sib tw tseem ceeb hauv kev tswj cov txheej txheem yog nyob rau hauv kev tswj qhov tob ntawm cov cua sov- thaj tsam cuam tshuam; Nws yog ib qho tseem ceeb kom ntseeg tau tias cov cua sov tsuas yog nyob rau hauv cov txheej txheem rau kev tshem tawm, yog li khaws cia cov kev ncaj ncees thiab cov khoom ntawm cov khoom siv substrate.

 

Tsis zoo li kev txiav txuas txuas ntxiv rau kev tig, laser-pab milling yog cov txheej txheem txiav tsis tu ncua uas ua los ntawm ntau cov kinematics nyuaj. Thaum lub sijhawm ua haujlwm milling, lub laser beam feem ntau scans lub workpiece nto ntawm ib lub kaum ntse ntse ua ntej ntawm lub milling cutter (raws li qhia hauv daim duab 2). Qhov zoo tshaj ntawm laser-pab milling yog nyob rau hauv nws lub peev xwm los tshem tawm cov khoom ntawm complex planar nto thiab kab noj hniav. Thaum siv rau siab - hardness pwm steels los yog titanium alloys, lub laser tshav kub qhov zoo softens lub nti tsim cheeb tsam, li no mitigating tej yam load los ntawm lub milling cutter cov hniav nyob rau hauv instant lawv koom lub workpiece. Cov txheej txheem preheating no hloov cov morphology ntawm cov chips, hloov lawv los ntawm kev tsis tu ncua, fragmented chips mus rau hauv tas li, helical chips -ib qho qhia tias cov khoom siv ductility tau txhim kho zoo heev. Hauv ntau-axis simultaneous machining operations, synchronization precision ntawm lub taub hau laser thiab milling spindle yog qhov tseem ceeb hauv kev txiav txim siab qhov zoo ntawm qhov tiav. Tam sim no, cov thev naus laus zis no tau siv rau kev ua haujlwm ntawm cov khoom siv sib txawv-xws li cov cav ntoo dav hlau- nrog rau lub hom phiaj tseem ceeb ntawm kev txo cov nqi tsim khoom los ntawm kev nce cov khoom tshem tawm ntawm ib chav tsev ntawm lub sijhawm.

 

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Laser-Assisted Sib Tsoo (LAG) muab cov yam ntxwv ntawm siab- lub zog hluav taws xob cua sov nrog kev sib tsoo; nws yog tsim tshwj xeeb rau kev ua cov ntaub ntawv uas tsis tshua muaj siab hardness thiab siab brittleness, xws li structural ceramics thiab optical iav. Cov txheej txheem no siv lub laser beam los preheat ib cheeb tsam hauv cheeb tsam tam sim ntawd ua ntej ntawm qhov sib tsoo, inducing thermal softening los yog theem transformations nyob rau hauv cov khoom txheej txheej. Qhov kev txiav txim no zoo txo ​​kev sib tsoo tsis kam thiab suppresses brittle chipping. Rau cov ntaub ntawv nkig, laser cua sov ua kom yooj yim "yas-kev sib tsoo," yog li txo qhov kev puas tsuaj microcrack rau ob qho tib si saum npoo thiab subsurface (raws li qhia hauv daim duab 3). Muab hais tias cov khoom tshem tawm tus nqi nkag mus rau txoj kev sib tsoo nws tus kheej yog qhov tsawg, kev tswj xyuas meej ntawm lub zog laser yog qhov tseem ceeb tshaj plaws los tiv thaiv kev puas tsuaj ntau dhau los yog kub hnyiab ntawm qhov chaw. Tsis tas li ntawd, kev pab laser yuav pab txo qis kev hnav ntawm lub log sib tsoo thiab tswj qhov ntse ntawm cov nplej abrasive. Nyob rau hauv ultra- precision machining ntawm semiconductor wafers thiab precision optical Cheebtsam, cov txheej txheem no ua hauj lwm pab raws li ib tug zoo txhais tau tias ua tau zoo -zoo, puas{12}} dawb nto.

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