Sep 22, 2025 Tso lus

'Beyond EUV' Chipmaking Tech Pushes Soft X-Ray Lithography Closer To Challenging Hyper-NA EUV

Cov kws tshawb fawb ntawm Johns Hopkins University tau tshaj tawm txoj hauv kev tshiab rau chipmaking uas siv cov lasers nrog 6.5nm ~ 6.7nm wavelength - tseem hu ua Soft X-rays - uas tuaj yeem ua rau muaj kev daws teeb meem ntawm cov cuab yeej lithography rau 5nm thiab hauv qab no, ceeb toom Cosmos luam tawm hauv Nature.

Cov kws tshawb fawb hu lawv txoj kev 'tho-EUV' - qhia tias lawv cov thev naus laus zis tuaj yeem hloov pauv kev lag luam- qauv EUV lithography - tab sis cov kws tshawb fawb lees paub tias tam sim no lawv nyob deb xyoo los ntawm kev tsim txawm tias kev sim B-EUV cuab yeej.

Micron

Soft X-Rays tuaj yeem sib tw Hyper-NA. Ntawm ntawv

Cov chips siab tshaj plaws niaj hnub no yog tsim los siv EUV lithography, uas ua haujlwm ntawm lub wavelength ntawm 13.5 nm thiab tuaj yeem tsim cov yam ntxwv me me li 13nm (Low-NA EUV ntawm 0.33 tus lej aperture), 8nm (High-NA EUV ntawm 0.54nper NA}), lossis txawm tias EUV ntawm 0.7 - 0.75 NA) ntawm tus nqi ntawm qhov nyuaj heev ntawm cov tshuab lithography uas muaj cov khoom siv kho qhov muag zoo heev uas raug nqi ntau pua lab nyiaj daus las.

 

Los ntawm kev siv lub voj voog luv luv, cov kws tshawb fawb los ntawm Johns Hopkins University tuaj yeem tau txais qhov kev daws teeb meem zoo tshaj plaws txawm tias cov lo ntsiab muag nrog NA nruab nrab. Txawm li cas los xij, lawv ntsib ntau qhov kev sib tw nrog B-EUV.

Ua ntej, B-EUV lub teeb ci tseem tsis tau npaj. Ntau tus kws tshawb fawb tau sim ntau txoj hauv kev tsim hluav taws xob 6.7 nm wavelength (xws li, gadolinium laser- tsim cov ntshav), tab sis tsis muaj kev lag luam - tus qauv mus kom ze. Qhov thib ob, cov luv luv wavelengths - vim lawv lub zog photon siab - cuam tshuam tsis zoo nrog cov khoom siv photoresist siv hauv chipmaking. Thib peb, vim tias 6.5nm ~ 6.7nm wavelength lub teeb yog absorbed es tsis yog reflected los ntawm txhua yam zoo nkauj, multilayer -coated tsom iav rau hom hluav taws xob tsis tau tsim ua ntej.

Hom Lithography

Lub wavelength

Achievable daws teeb meem

Photon Zog

Numerical Aperture (NA)

Sau ntawv

g- kab (Pre-DUV)

436nm ua

500nm ua

2, 84 eV

0.3

Siv mercury vapor teeb; cov kab ke qub txeeg qub teg; daws teeb meem tsawg.

i- kab (Pre-DUV)

365nm ua

350nm ua

3, 40 eV

0.3

Siv rau thaum ntxov CMOS.

KRF DUV

248nm ua

90nm ua

5.00 Nws

0.7 - 1.0

Siv los ntawm ~ 130 nm txog 90 nm; excimer laser qhov chaw; tseem siv nyob rau hauv backend txheej.

ArF DUV

193nm ua

65 nm (qhuav) - 45 nm (immersion + multipatterning)

6, 42 ewv

Mus txog 1.35 (immersion)

Tshaj siab tshaj DUV; tseem tseem ceeb hauv ntau-patterned 7 nm–5 nm nodes; siv rau ntau txheej hauv 2nm nodes.

EUV

13.5nm ua

13nm (native), 8nm (ntau- qauv)

92e vwm

0.33

Hauv ntim ntau lawm rau 5nm - 2nm nodes. Yuav siv tau rau xyoo tom ntej.

High-NA EUV

13.5nm ua

8nm (native), 5nm (ntxiv)

92e vwm

0.55

Thawj cov cuab yeej: ASML EXE: 5200B; lub hom phiaj tshaj 2 nm-chav kawm nodes; txo qhov loj me, tus nqi siab dua.

Hyper-NA EUV (future)

13.5nm ua

4 nm los yog zoo dua (theoretical)

92e vwm

0.75 los yog ntau dua

Yav tom ntej tech; xav tau cov iav txawv thiab ultra-high precision engineering.

Soft X-ray / B-EUV

6.5nm- 6.7 nm

tsawg dua 5 nm (theoretical)

185-190 EV

0.3 - 0.5 (xav tau)

Kev sim; siab-zog photons; tshiab hlau-organic tiv thaiv chemistry nyob rau hauv kev sim.

Thaum kawg, cov cuab yeej lithography no yuav tsum tau tsim los ntawm kos, thiab tam sim no, tsis muaj ecosystem los txhawb cov qauv tsim nrog cov khoom siv thiab cov khoom siv. Txhawm rau ua kom tiav, tsim lub tshuab B-EUV (los yog Soft X-ray tshuab?) yuav tsum muaj kev sib tw hauv cov teeb pom kev zoo, tsom iav tsom iav, tiv thaiv, thiab txawm tias cov khoom siv xws li pellicles lossis photomasks.

 

Kev daws teeb meem ib zaug

Cov kws tshawb fawb ntawm Johns Hopkins University, coj los ntawm xibfwb Michael Tsapatsis, tau tshawb nrhiav qee yam hlau tuaj yeem txhim kho kev sib cuam tshuam ntawm B-EUV (nyob ib puag ncig 6 nm wavelength) lub teeb thiab tiv thaiv cov ntaub ntawv siv hauv chipmaking (xws li, lawv tsis ua hauj lwm rau lwm yam teeb meem cuam tshuam nrog Soft X-rays).

 

Pab pawg tau tshawb pom tias cov hlau zoo li zinc muaj peev xwm nqus tau B-EUV lub teeb thiab emit electrons, uas tom qab ntawd ua rau muaj tshuaj lom neeg hauv cov organic sib txuas hu ua imidazoles. Cov tshuaj tiv thaiv no ua rau nws tuaj yeem ua cov qauv zoo heev rau cov khoom siv hluav taws xob semiconductor.

Interestingly, thaum zinc ua tsis zoo nrog cov tsoos 13.5nm EUV lub teeb, nws ua tau zoo heev ntawm luv wavelengths, qhia tias nws tseem ceeb npaum li cas kom phim cov khoom siv nrog lub wavelength txoj cai.

Txhawm rau siv cov hlau-organic compounds rau silicon wafers, cov kws tshawb fawb tau tsim cov txheej txheem hu ua chemical liquid deposition (CLD). Txoj kev no tsim nyias, daim iav-zoo li txheej ntawm cov khoom hu ua aZIF (amorphous zeolitic imidazolate moj khaum), loj hlob ntawm tus nqi ntawm 1nm ib ob. CLD kuj tso cai rau kev sim ceev ceev ntawm cov hlau sib txawv-imidazole ua ke, ua rau nws yooj yim dua los nrhiav kev sib koom ua ke zoo tshaj plaws rau kev sib txawv lithography wavelengths. Thaum zinc zoo haum rau B-EUV, pab pawg tau sau tseg tias lwm cov hlau yuav ua tau zoo dua ntawm qhov sib txawv wavelengths, muab kev yooj yim rau yav tom ntej chipmaking technologies.

Txoj hauv kev no muab cov tuam txhab tsim cov cuab yeej ntawm yam tsawg kawg 10 cov ntsiab lus hlau thiab ntau pua ntawm cov organic ligands los tsim kev cai tiv thaiv kom haum rau cov txheej txheem lithography tshwj xeeb, cov kws tshawb fawb tau tshaj tawm.

Cov ntsiab lus

Txawm hais tias cov kws tshawb fawb tsis tau daws tag nrho pawg ntawm B-EUV cov kev cov nyom (xws li, lub zog, lub qhov ncauj qhov ntswg), lawv tau nce ib qho tseem ceeb tshaj plaws hauv lub cev: nrhiav cov khoom tiv thaiv uas tuaj yeem ua haujlwm nrog 6nm wavelength teeb. Lawv tsim cov txheej txheem CLD los siv cov yeeb yaj kiab nyias nyias ntawm amorphous zeolitic imidazolate moj khaum (aZIFs) mus rau silicon wafers. Lawv tau sim pom tias qee cov hlau (xws li zinc) tuaj yeem nqus tau Soft X-ray lub teeb thiab emit electrons uas ua rau muaj tshuaj lom neeg hauv imidazole-raws li resists.

Muaj ntau qhov kev sib tw los daws nrog B-EUV, thiab cov thev naus laus zis tsis muaj txoj hauv kev meej rau kev lag luam loj. Txawm li cas los xij, cov txheej txheem CLD tuaj yeem siv tau zoo nkauj, ob qho tib si hauv semiconductor thiab tsis yog -semiconductor applications.

Ua rawsTom's Hardware on Google News, los yogntxiv rau peb raws li qhov xav tau, kom tau txais peb li -rau- hnub xov xwm, kev tshuaj xyuas, thiab kev tshuaj xyuas hauv koj cov khoom noj. Nco ntsoov nias lub khawm Ua raws!

 

 

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